Publication Date

2025

Document Type

Dissertation/Thesis

First Advisor

Salehinia, Iman

Degree Name

M.S. (Master of Science)

Legacy Department

Department of Mechanical Engineering

Abstract

Metal nanolaminates are known in material science for their unique mechanical properties and high strength due to their interface behavior. Cu/Nb nanolaminates specifically are studied for their uses in electronics due to their good conductivity and superior tensile strength compared to copper conductors, as well as their radiation resistance in radioactive environments. Currently, most molecular dynamics (MD) simulations of Cu/Nb simulations are axially loaded. This work attempts to characterize the scratching behavior of Cu/Nb nanolaminates with varying indenter size, temperature, speed, and layer thickness. The coefficient of friction (CoF), friction force, normal force, and material removal were then compared. A diamond indenter simulation was also made using a variety of Lennard-Jones interatomic potentials. This was to study the effects of indenter type with varying interatomic potential compared to the more common and simple purely repulsive indenter. LAMMPS was used to perform the MD simulations. It was found that CoF, friction force, normal force, and material removal all varied most with indenter size, while layer thickness and temperature made smaller differences. Scratching speed in the range tested made very small differences.

Extent

98 pages

Language

en

Publisher

Northern Illinois University

Rights Statement

In Copyright

Rights Statement 2

NIU theses are protected by copyright. They may be viewed from Huskie Commons for any purpose, but reproduction or distribution in any format is prohibited without the written permission of the authors.

Media Type

Text

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