Numerical simulation of PCM-encapsulated heat sinks for electronic chips

Author

Beimin Liu

Publication Date

2001

Document Type

Dissertation/Thesis

Degree Name

M.S. (Master of Science)

Legacy Department

Department of Mechanical Engineering

LCSH

Heat sinks (Electronics)--Mathematical models; Integrated circuits--Mathematical models

Comments

Includes bibliographical references (pages [86]-87)

Recommended Citation

Liu, Beimin, "Numerical simulation of PCM-encapsulated heat sinks for electronic chips" (2001). Graduate Research Theses & Dissertations. 4148.
https://huskiecommons.lib.niu.edu/allgraduate-thesesdissertations/4148

Extent

ix, 87 pages

Language

eng

Publisher

Northern Illinois University

Rights Statement

In Copyright

Rights Statement 2

NIU theses are protected by copyright. They may be viewed from Huskie Commons for any purpose, but reproduction or distribution in any format is prohibited without the written permission of the authors.

Media Type

Text