Publication Date

1995

Document Type

Dissertation/Thesis

First Advisor

Gupta, Abhijit

Degree Name

M.S. (Master of Science)

Department

Department of Mechanical Engineering

LCSH

Capacitors--Vibration||Surface mount technology||Materials--Fatigue

Abstract

Fatigue failures are known to occur in leads of surface mount electronic components, when electronic printed circuit assemblies are subjected to severe vibrational loads. Exposure to random vibration is a test criterion used to screen, compare, and validate components for automotive and aerospace applications. As a result, the reliability of surface mount type interconnections is reduced. Fatigue life of leads in such packages is a complex function of constitutive properties, architecture and geometry of the package and vibrational loads applied to it. A logical and consistent method for calculating fatigue life due to random vibration is needed. Finite element analysis is sometimes employed to help understand or correct random vibration induced failures. The main objective of the present study is to formulate a model based on finite element analysis, to analyze fatigue endurance of leads in surface mount type packages. The goal is to formulate a tool which can be used to examine the influence of several parameters on fatigue life of leads.

Comments

Includes bibliographical references (leaf [44])

Extent

vii, 52 pages

Language

eng

Publisher

Northern Illinois University

Rights Statement

In Copyright

Rights Statement 2

NIU theses are protected by copyright. They may be viewed from Huskie Commons for any purpose, but reproduction or distribution in any format is prohibited without the written permission of the authors.

Media Type

Text

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