Publication Date


Document Type


First Advisor

Gupta, Abhijit

Degree Name

M.S. (Master of Science)

Legacy Department

Department of Mechanical Engineering


Capacitors--Vibration; Surface mount technology; Materials--Fatigue


Fatigue failures are known to occur in leads of surface mount electronic components, when electronic printed circuit assemblies are subjected to severe vibrational loads. Exposure to random vibration is a test criterion used to screen, compare, and validate components for automotive and aerospace applications. As a result, the reliability of surface mount type interconnections is reduced. Fatigue life of leads in such packages is a complex function of constitutive properties, architecture and geometry of the package and vibrational loads applied to it. A logical and consistent method for calculating fatigue life due to random vibration is needed. Finite element analysis is sometimes employed to help understand or correct random vibration induced failures. The main objective of the present study is to formulate a model based on finite element analysis, to analyze fatigue endurance of leads in surface mount type packages. The goal is to formulate a tool which can be used to examine the influence of several parameters on fatigue life of leads.


Includes bibliographical references (leaf [44])


vii, 52 pages




Northern Illinois University

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