Alt Title

Determination and development of procedures necessary for the manufacture and testing of thin-film multichip modules fabricated on silicon substrates

Publication Date

1999

Document Type

Dissertation/Thesis

First Advisor

Genis, Alan P.

Degree Name

M.S. (Master of Science)

Legacy Department

Department of Electrical Engineering

LCSH

Multichip modules (Microelectronics)--Illinois--De Kalb; Thin-film circuits; Microelectronic packaging

Abstract

This study deals with multichip modules (MCMs), relatively new packaging technology that is considered to be one of the most efficient to date. It describes classification of multichip modules and manufacturing steps necessary to build MCMs, as well as process parameters, current standards and achievements in this field. The project is focused on results obtained from experiments with metal deposition in the NIU Microelectronics Research and Development Laboratory and comparison of collected data to current industry standards. Also general MCM information is provided to outline possible areas for future research.

Comments

Includes bibliographical references (pages [58]-59)

Extent

59 pages

Language

eng

Publisher

Northern Illinois University

Rights Statement

In Copyright

Rights Statement 2

NIU theses are protected by copyright. They may be viewed from Huskie Commons for any purpose, but reproduction or distribution in any format is prohibited without the written permission of the authors.

Media Type

Text

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