Thermal Stress Analysis of Liquid-Cooled 3D-ICs

Author ORCID Identifier

Ibrahim Abdel-Motaleb:https://orcid.org/0000-0002-7845-4729

Publication Title

IEEE International Conference on Electro Information Technology

ISSN

21540357

E-ISSN

21540373

ISBN

9781728153179

Document Type

Conference Proceeding

Abstract

It is known that 3D-ICs suffer from hot spot temperatures that can reach thousands of degrees if they are not cooled to reasonable operating temperatures. The problem of hot spots is not limited to the high temperatures of the IC; thermal stress can also pose severe problems, even after cooling the chip. This study investigates thermal stress resulting from a 3D-IC hot spot with 20 W power dissipation. The IC is cooled using SiO2 and diamond cooling blocks. The study is performed using three coolants: water, Freon (R22), and Liquid Nitrogen (LN). As expected, the study shows that metal layers on the chip suffer from high thermal stress due to rising of the chip temperature to values higher than the room temperature. It is also noticed that the stress becomes more severe if cooling is done using LN. In fact, the stress exceeded the maximum tensile strength of aluminum, which might cause failure of the chip. This indicates that cooling 3D-IC may not ensure acceptable operation or reliability. Thermal stress must be investigated at both high and low temperatures to ensure high performance and acceptable reliability.

First Page

132

Last Page

135

Publication Date

7-1-2020

DOI

10.1109/EIT48999.2020.9208317

Keywords

3D-IC, COMSOL, Liquid Cooling, Thermal Stress

Department

Department of Electrical Engineering

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