Numerical Analysis of Liquid Cooling of 3D-ICs Using Embedded Channels

Author ORCID Identifier

Ibrahim Abdel-Motaleb:https://orcid.org/0000-0002-7845-4730

Publication Title

IEEE International Conference on Electro Information Technology

ISSN

21540357

E-ISSN

21540373

ISBN

9781728153179

Document Type

Conference Proceeding

Abstract

Hot-spots are considered among the unavoidable consequences of the high integration density of 3D-ICs. Eliminating hotspots requires employing efficient cooling techniques. Using embedded channels, liquid cooling systems can be designed to deliver the right amount of coolant to each spot of the chip. In this study, numerical analysis is used to investigate the cooling of a 20 W hotspot using embedded channels employing three coolants: water, Freon (R22), and liquid nitrogen (LN). The investigation of thermal management and stress show that, although LN provides the lowest operating temperature (164 K), it causes the highest stress (355 MPa) at 100 mm/s inlet velocity. The study also shows that, coolant delivery using parallel channels results in a wide variation of local temperatures and stress. This stress variation may form 'high-stress spots,' which may cause circuit failure, performance degradation, or yield reduction. Therefore, cooling systems and chip fabrication should be designed to ensure the elimination of high-stress hotspots.

First Page

233

Last Page

238

Publication Date

7-1-2020

DOI

10.1109/EIT48999.2020.9208330

Keywords

3D-IC, Chip Embedded Cooling, COMSOL, Heat transfer, Thermal Stress analysis

Department

Department of Electrical Engineering

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