Publication Date
1996
Document Type
Dissertation/Thesis
First Advisor
Krmenec, Andrew J.
Degree Name
M.S. (Master of Science)
Legacy Department
Department of Geography
LCSH
High technology industries--Illinois--Chicago Metropolitan Area; Chicago Metropolitan Area (Ill.)--Economic conditions
Abstract
The changing geography of the United States manufacturing industry is of major importance to local and regional economies. This is definitely the case in the Midwest, which has suffered the brunt of industry decentralization over the last thirty years. Looking for ways to end economic decline caused by the losses in establishments and employment, many agencies turned toward high-technology industries. Comparative analysis indicates that the Chicago region has not been very competitive to other CMS As in terms of high-technology development. This might be due to the agglomeration effect of historical areas of "high-tech" such as exist in Los Angeles and Boston, or to the technological and structural changes occurring throughout the United States production economy. Analysis also shows that hightechnology manufacturing did decentralize away from the Cook County core between 1983 and 1991. Factors that might be involved in this decentralization include change in the highly skilled work force, and change in the level of business services found in suburban counties as opposed to the Chicago area?s core.
Recommended Citation
Riggs, Martin A., "High-technology manufacturing in the Chicago Metropolitan Area : comparative analysis, industrial decentralization, and location factors" (1996). Graduate Research Theses & Dissertations. 3381.
https://huskiecommons.lib.niu.edu/allgraduate-thesesdissertations/3381
Extent
iv, 70 pages
Language
eng
Publisher
Northern Illinois University
Rights Statement
In Copyright
Rights Statement 2
NIU theses are protected by copyright. They may be viewed from Huskie Commons for any purpose, but reproduction or distribution in any format is prohibited without the written permission of the authors.
Media Type
Text
Comments
Includes bibliographical references (pages [67]-70)