Author

Telmo Olivos

Publication Date

1991

Document Type

Dissertation/Thesis

First Advisor

Majumdar, Pradip, 1954-

Degree Name

M.S. (Master of Science)

Department

Department of Mechanical Engineering

LCSH

Electronic apparatus and appliances--Cooling--Mathematical models

Abstract

A computational description of heat transfer dissipation in printed circuit boards is developed in this work. Accordingly, a mathematical model that describes forced convection cooling of a periodic array of heated modules attached to a wall of a parallel channel is presented. The model deals with a two-dimensional, laminar, newtonian, and incompressible flow which has constant thermodynamic properties; these conditions simplify the derivation of the governing physical laws. After all the conditions involved in the problem are reduced to a set of differential equations, a convenient method of numerical discretization is used to transform these differential equations into a set of linear algebraic equations. Because of the geometric characteristics, a finite difference scheme that employs a control volume approach is chosen. An algorithm is introduced to solve the continuity and the momentum equations linking pressure and velocity; then the velocity field, found previously, is used as the input parameter of the energy equation to determine the temperature distribution of the flow. The computational code is used to carry out a parametric study using different conditions and geometric parameters. Comparisons are made with other available predictions and experimental information.

Comments

Includes bibliographical references (pages [84]-86)

Extent

ix, 86 pages

Language

eng

Publisher

Northern Illinois University

Rights Statement

In Copyright

Rights Statement 2

NIU theses are protected by copyright. They may be viewed from Huskie Commons for any purpose, but reproduction or distribution in any format is prohibited without the written permission of the authors.

Media Type

Text

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