Majumdar, Pradip, 1954-
M.S. (Master of Science)
Department of Mechanical Engineering
Electronic apparatus and appliances--Cooling--Mathematical models
A computational description of heat transfer dissipation in printed circuit boards is developed in this work. Accordingly, a mathematical model that describes forced convection cooling of a periodic array of heated modules attached to a wall of a parallel channel is presented. The model deals with a two-dimensional, laminar, newtonian, and incompressible flow which has constant thermodynamic properties; these conditions simplify the derivation of the governing physical laws. After all the conditions involved in the problem are reduced to a set of differential equations, a convenient method of numerical discretization is used to transform these differential equations into a set of linear algebraic equations. Because of the geometric characteristics, a finite difference scheme that employs a control volume approach is chosen. An algorithm is introduced to solve the continuity and the momentum equations linking pressure and velocity; then the velocity field, found previously, is used as the input parameter of the energy equation to determine the temperature distribution of the flow. The computational code is used to carry out a parametric study using different conditions and geometric parameters. Comparisons are made with other available predictions and experimental information.
Olivos, Telmo, "A computational model for convective cooling processes in electronic components" (1991). Graduate Research Theses & Dissertations. 223.
ix, 86 pages
Northern Illinois University
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