Publication Date


Document Type


First Advisor

Majumdar, Pradip, 1954-

Degree Name

M.S. (Master of Science)

Legacy Department

Department of Mechanical Engineering


Mechanical engineering


Thermal management is one of the most critical issues in electronics due to increasing power densities. This problem is getting even worse for small and sophisticated devices due to air gaps present between the heat source and heat sink; air gaps are thermal barriers to the heat dissipation path. Thermal interface materials (TIM) are used to reduce the air gaps; TIM placed in between heat source and heat sink significantly increases the heat transfer capability of the system. The ability to work at large temperature cycling results in reduction of thermo-mechanical reliability for the traditional TIMs. A high thermal performance, cost effective and reliable TIM would be needed to dissipate the generated heat, which could enable significant reductions in weight, volume and cost of the thermal management system. The objective of this research is to design advanced TIM by finding the composition of boron arsenide as filler in polymer-nanostructured material which can outperform traditional TIMs when it is used in high heat fluxes applications including space and aerospace applications. A three-dimensional computational analysis model is developed to evaluate boron arsenide-based TIM in terms spreading of heat and reduction junction temperature using an Insulated Gate Bipolar Transistor (IGBT) power module in a forced air convective environment.


Advisors: Pradip Majumdar.||Committee members: Iman Salehinia; John Shelton.||Includes bibliographical references.||Includes illustrations.


viii, 76 pages




Northern Illinois University

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