Determination and development of procedures necessary for the manufacture and testing of thin-film multichip modules fabricated on silicon substrates
Genis, Alan P.
M.S. (Master of Science)
Department of Electrical Engineering
Multichip modules (Microelectronics)--Illinois--De Kalb||Thin-film circuits||Microelectronic packaging
This study deals with multichip modules (MCMs), relatively new packaging technology that is considered to be one of the most efficient to date. It describes classification of multichip modules and manufacturing steps necessary to build MCMs, as well as process parameters, current standards and achievements in this field. The project is focused on results obtained from experiments with metal deposition in the NIU Microelectronics Research and Development Laboratory and comparison of collected data to current industry standards. Also general MCM information is provided to outline possible areas for future research.
Marchenko, Dmytro E., "Determination and development of procedures necesssary for the manufacture and testing of thin-film multichip modules fabricated on silicon substrates" (1999). Graduate Research Theses & Dissertations. 2136.
Northern Illinois University
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